Mobile Repairing (Chip Level)

Who's it for : This course is for students who love gadgets and want to learn how to fix them from the inside. You will learn how to repair mobile motherboards and change small parts that others can't fix. It is a great way to start a career in the mobile industry or open your own service center.

Duration : 6 Months + 2 Months On Job Training
Rating : 4.9

4.9

Courses Rating

320+

Happy Students


Course starts :
1st June, 2026

Only limited seats are open

Program Outline

This program takes you deep into the hardware of modern smartphones, focusing on micro-soldering and chip-level diagnostics. You will learn how to use advanced tools to find faults in the motherboard, replace damaged ICs, and fix charging or network issues. We also cover software flashing and unlocking techniques for various mobile brands. This course gives you the technical expertise to fix complex internal problems that go beyond simple parts replacement.

Key Focuses

  • Smartphone Architecture & Block Diagrams
  • Micro-Soldering Techniques for Small Parts
  • IC Reballing & Replacement (CPU, Power)
  • Identifying Short Circuits using Multimeters
  • Display/Combo (Lamination) Replacement
  • Water Damage & Dead Phone Recovery
  • Hardware Tracing & Jumper Techniques
  • Software Flashing & Pattern Unlocking
  • Using DC Power Supply & SMD Rework Stations
  • Charging, Network, and Audio Fault Repairing
  • 2 Months On-Job Training
  • Service Center Setup & Career

San Edutech Job Assistance

You will get 100% job assistance after completing the Mobile Repairing (Chip Level) course. We will train you through hands-on practical sessions and 2 months of on-job training to make you a skilled mobile technician. This course will prepare you to start your own service center or work with mobile repair shops. You will receive a professional certificate from our institute upon successful completion.

Professional Certificate
2 Months On-Job Training
Resume and career assistance
Interview preparation
Mobile Service Center Placement*

*T&C applied